Cross Kerf Plugin

A specialised analysis tool designed for measuring the critical dimensions of intersecting kerf lines – commonly found in wafer dicing, photolithography, and microfabrication processes. It enables users to quickly quantify trench widths, kerf angles, and corner sharpness at cross-shaped intersections, where accurate characterisation is essential for yield control and process validation.

With high repeatability and intuitive controls, this plugin streamlines complex geometrical analysis, making it ideal for both production environments and advanced research settings.

• Automated Kerf Detection
  Automatically detects and isolates vertical and horizontal kerf lines at intersection points using robust edge-detection algorithms.
• Width and Angle Measurements
  Precisely measures kerf widths, taper angles, and corner angles in both X and Y directions.
• Corner Analysis
  Analyses the geometry of kerf intersections, identifying sharpness, rounding, or defects at the corners.
• 2D Profile and 3D Surface Support
  Works on both extracted 2D profiles and full 3D surface topographies for versatile inspection capabilities.
• Multiple Measurement Zones
  Allows users to analyse multiple cross-kerf locations within a single scan for statistical and batch inspection.
• Customisable Region of Interest (ROI)
  Provides tools for manual ROI selection and adjustment to focus on specific cross-section areas or ignore surface anomalies.
• High Repeatability and Accuracy
  Uses advanced fitting and edge extraction techniques for highly repeatable, traceable measurements even in noisy or complex datasets.
• Comprehensive Reporting
  Exports visual overlays, dimension tables, and full reports for quality control, process documentation, or compliance auditing.
• Semiconductor Industry Optimisation
  Tailored to meet the rigorous inspection needs of wafer dicing lanes, mask alignment marks, and other lithographic features.