Bump Plugin

Designed for automated, high‑precision analysis of bump structures – central to flip‑chip and Ball Grid Array (BGA) packaging.

It identifies individual bumps or complete arrays and extracts critical parameters such as height, diameter, and coplanarity. This enables rapid pass/fail decisions to ensure electrical reliability, mechanical integrity, and alignment accuracy in advanced semiconductor packaging.

Full Bump Array Detection

• Automatically locates and analyses bumps—single or full BGA arrays—across a wafer or PCB surface.
• Supports high-density arrays with thousands of bump features.

Critical Dimension Measurements

Measures key geometric parameters including:

• Height
• Diameter or width
• Coplanarity (planarity)
• Ensures bumps are within design tolerances for reliable electrical connection.

Automatic Statistical Reporting & Tolerances

• Computes per‑bump and array statistics (mean, standard deviation).
• Pass/fail evaluation based on user‑defined thresholds.
• Flags bumps outside tolerance limits for immediate review.

Pre‑Processing & Optimisation Tools

• Adjustable filters, height thresholding, and cropping settings let users refine surface data.
• Ensures consistent and repeatable bump detection even on textured or noisy surfaces