Used to analyse kerf marks in the form of a cross present on a wafer.
A specialised analysis tool designed for measuring the critical dimensions of intersecting kerf lines – commonly found in wafer dicing, photolithography, and microfabrication processes. It enables users to quickly quantify trench widths, kerf angles, and corner sharpness at cross-shaped intersections, where accurate characterisation is essential for yield control and process validation.
With high repeatability and intuitive controls, this plugin streamlines complex geometrical analysis, making it ideal for both production environments and advanced research settings.
