Wafer Groove Plugin

Specialised software module tailored for semiconductor back-end metrology. It automates the analysis of sawing (dicing) cuts in wafers – critical for determining die separation quality in chip production.

This ensures precise control over groove characteristics like depth, width, angles, and surface finish – vital for avoiding chipping or structural defects

Automatic Groove Detection

• Identifies one or multiple groove traces in the scanned topography automatically.
• Supports various configurations: single-line, two-line, and multi-line groove analyses.

Comprehensive Parametric Analysis

• Delivers geometry metrics like groove depth, width, angle, and taper.
• Calculates profile descriptors (e.g., sidewall angles, cross-sectional area) critical to defect detection.

Flexible Multi-line Processing

• Capable of analysing up to six trace lines simultaneously.
• This multi-trace functionality enhances robustness, especially in non-ideal or noisy dicing scenarios.

Integrated Tolerance & Pass/Fail Reporting

• Built-in parameter thresholds allow immediate pass/fail evaluation per wafer/cut.
• Streamlines yield control—non-conforming grooves are instantly flagged.

Preprocessing Tools

• Includes adjustable filters, height thresholding, and cropping options.
• Users can optimise input data for more consistent and accurate groove measurements.