Specialised software module tailored for semiconductor back-end metrology. It automates the analysis of sawing (dicing) cuts in wafers – critical for determining die separation quality in chip production.
This ensures precise control over groove characteristics like depth, width, angles, and surface finish – vital for avoiding chipping or structural defects
Automatic Groove Detection
- Identifies one or multiple groove traces in the scanned topography automatically.
- Supports various configurations: single-line, two-line, and multi-line groove analyses.
Comprehensive Parametric Analysis
- Delivers geometry metrics like groove depth, width, angle, and taper.
- Calculates profile descriptors (e.g., sidewall angles, cross-sectional area) critical to defect detection.
Flexible Multi-line Processing
- Capable of analysing up to six trace lines simultaneously.
- This multi-trace functionality enhances robustness, especially in non-ideal or noisy dicing scenarios.
Integrated Tolerance & Pass/Fail Reporting
- Built-in parameter thresholds allow immediate pass/fail evaluation per wafer/cut.
- Streamlines yield control—non-conforming grooves are instantly flagged.
Preprocessing Tools
- Includes adjustable filters, height thresholding, and cropping options.
- Users can optimise input data for more consistent and accurate groove measurements.
